CareerPlan

Module Equipment Development Engineer

US, Oregon, HillsboroFull-time$115k–$220k2026-11-06 → 2026-11-10
Hybrid · United States

Core

Lead the development and optimization of advanced semiconductor manufacturing equipment and processes for dielectrics thin films to enable high-performance device production.

Role type

Senior IC equipment development engineer (semiconductor manufacturing)

Builds

Advanced semiconductor manufacturing equipment modules and processes for Intel Foundry Technology

Domain

Semiconductor manufacturing / Materials Science / Chemical Engineering

Required skills

Semiconductor processing techniques (lithography, etching, thin film deposition, planarization), Process characterization and statistical analysis (JMP, MATLAB, Python), Materials characterization (SEM, TEM, XPS, ellipsometry), Equipment metrology, Statistical Process Control (SPC), Design of Experiments (DOE)

Preferred skills

Equipment troubleshooting and maintenance, Experience with tool suppliers, Vacuum processes (ALD, CVD), Cross-functional collaboration

Technologies

JMP, MATLAB, Python, SEM, TEM, XPS, ellipsometry, ALD, CVD

Responsibilities

Develop equipment capable of delivering new process requirements in dielectrics thin films; Design and execute experiments to optimize manufacturing processes; Collaborate with suppliers to qualify and implement novel technologies; Support technology transfer to high-volume manufacturing; Perform feasibility studies for future technology roadmaps; Utilize SPC and DOE for process improvements

Seniority

Senior, hands-on IC