Member of Technical Staff - Thin Films Engineer
Core
Lead thin film process excellence and optimization for advanced semiconductor nodes (18A, 3, 12nm) bridging Technology Development and High-Volume Manufacturing.
Role type
Senior IC manufacturing engineer (thin films)
Builds
High-yield production of advanced logic and memory chips for Intel foundry customers
Domain
Semiconductor manufacturing / Thin film deposition
Required skills
Thin film deposition (CVD, ALD, PVD, epitaxy), Statistical Process Control (SPC), Design of Experiments (DOE), yield improvement, defectivity reduction, equipment optimization, fab startup, cross-functional technical leadership
Preferred skills
Gate All Around (GAA) logic technologies, PhD in relevant STEM field, research publications, patent portfolio, foundry business model expertise
Technologies
CVD, ALD, PVD, Epitaxy, Furnace, Implant, Anneal, Factory automation systems, SPC, DOE
Responsibilities
Drive defectivity reduction and uniformity improvements through systematic process enhancement; Optimize equipment performance working with internal teams and key suppliers; Align technical vision with customer requirements and business objectives; Collaborate with Technology Development, High Volume Manufacturing, and Business Groups; Present technical findings to diverse audiences from engineering teams to executive leadership; Stay current with semiconductor industry trends and emerging process technologies
Seniority
Senior, hands-on IC