CareerPlan

Thin Films Module Development Engineer

US, Oregon, HillsboroFull-time$156k–$255k2026-10-30 → 2026-11-10
On-site · United States

Core

Developing and delivering metals modules for advanced semiconductor technologies to fulfill program process needs within hardware capabilities.

Role type

Senior IC process development engineer (thin films/metals)

Builds

Metals modules for advanced semiconductor technology nodes

Domain

Semiconductor manufacturing / Process development

Required skills

Process optimization, defect reduction, Design of Experiments (DOE), Statistical Process Control (SPC), dry etch processes, material science, equipment metrology, semiconductor manufacturing equipment operation

Preferred skills

Sub-10nm technology node experience, advanced device architectures (FinFET, GAA), Technology Development (TD) and High Volume Manufacturing (HVM) delivery, cross-functional leadership for yield improvement, mentoring engineers

Technologies

Semiconductor manufacturing equipment, metrology tools

Responsibilities

Formulate technical problem statements, establish roadmaps and timelines, lead with data, partner with stakeholders to deliver on-time results, optimize hardware and materials with suppliers

Seniority

Senior, hands-on IC