Advanced Packaging TD Plating Module Engineer
Core
Develop and optimize advanced manufacturing processes, including material selection, equipment metrology, and system design for next-generation semiconductor architectures.
Role type
Senior IC process development engineer (advanced packaging/plating)
Builds
High-volume manufacturing solutions for next-generation device architectures
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
semiconductor processing, advanced packaging technology development, statistical process control, manufacturing process improvements, feasibility studies, simulations, process integration
Preferred skills
plasma etch, plating processes, thin-film deposition, wafer-level assembly, hybrid bonded interconnects, program leadership from strategy to high-volume production
Technologies
metrology, statistical process control, data analytics
Responsibilities
Develop and optimize advanced manufacturing processes; Conduct feasibility studies and simulations; Drive process innovation and pathfinding activities; Collaborate with equipment and material suppliers; Develop technology roadmaps; Monitor production efficiency; Utilize statistical process control and data analytics; Partner with cross-functional teams
Seniority
Senior, hands-on IC