Senior Thin Films Metals Deposition Engineer
Core
Enable best-in-class process performance and manufacturability for advanced metals deposition modules across Intel 18A, Intel 3, and Intel 12nm technology nodes, driving module readiness from early development through high-volume manufacturing ramp.
Role type
Senior IC metals deposition engineer (semiconductor manufacturing)
Builds
Advanced logic technology nodes (18A, 3, 12nm) with robust, predictable silicon delivery
Domain
Semiconductor manufacturing / Thin film deposition
Required skills
Thin film deposition technologies (PVD, CVD, ALD), metals deposition modules (Frontend, MOL, BEOL), integration with CMP/lithography/etch/clean, data-driven root cause analysis, cross-functional team leadership, process optimization, technology transfer to HVM
Preferred skills
Advanced technology nodes (10nm class and below), interconnect and MOL physics (RC performance, electromigration, reliability), equipment qualification and tool matching, supplier collaboration on hardware/chemistry changes, cross-site task force leadership
Technologies
PVD, CVD, ALD, W, Co, Ru, Cu, CMP, lithography, etch, clean
Responsibilities
Formulate technical strategies to deliver cutting-edge solutions, perform data-driven root cause analysis using structured problem-solving methods, engage with internal and external stakeholders (Yield, Defect Metrology, Quality, Reliability, suppliers), define team goals and remove roadblocks, work in person with team members to enable faster decision making
Seniority
Senior, hands-on IC