Advanced Packaging Module Engineering Manager
Core
Lead a team of engineers to support high-volume manufacturing processes and drive advancements in next-generation packaging technologies.
Role type
Engineering Manager (Advanced Packaging)
Builds
High-volume semiconductor packaging products
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Process characterization, troubleshooting, process improvement, lean manufacturing, team leadership, performance management, technology transfer, factory transition management, strategic planning
Preferred skills
Operational excellence, innovation, vendor collaboration, strategic planning for manufacturing efficiency
Technologies
Semiconductor processing equipment, Early Tool Sets
Responsibilities
Lead and manage a team of engineers to support safe, high-volume manufacturing processes; Provide tactical direction for sustaining operations and process optimization; Collaborate with cross-functional teams to address integrated process challenges; Develop and mentor engineers; Drive results through decision-making and performance management; Facilitate technology transfer and conduct training/audits; Oversee installation and ramp production of Early Tool Sets; Develop long-term strategies to enhance engineering capabilities.
Seniority
Manager, hands-on leadership
