Process Integration and Yield Technician (ICE)
Core
Provide manufacturing sustaining and engineering development support for semiconductor wafer packaging operations, focusing on material disposition, process troubleshooting, and defect investigation.
Role type
Manufacturing Integration Yield Technician (IC)
Builds
Semiconductor wafer packaging products (HBI, WLA, Die Prep, TSVr)
Domain
Semiconductor manufacturing / Wafer Packaging
Required skills
Material disposition and lot movement management, Manufacturing system troubleshooting, Defect investigation and failure analysis support, Process excursion containment, Data collection and basic analysis, Cleanroom operations compliance
Preferred skills
SQL and data analysis (JMP, GAJT), HBI/Die Prep/WLA/TSVr process knowledge, Experience in ambiguous dynamic environments
Technologies
SQL, iTech, JMP, GAJT, Microsoft applications
Responsibilities
Manage material disposition and lot movement, Troubleshoot manufacturing systems and automation issues, Respond to factory escalations and process excursions, Support defect investigation and failure analysis, Collect and communicate technical data, Coordinate daily factory support
Seniority
Mid-level, hands-on IC