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Module Engineering PhD Intern Summer 2027

US, Oregon, Hillsboro💼 Internship💰 $120,898–$120,898🗓 2026-09-15 → 2026-09-26

Core

Develop and optimize semiconductor manufacturing processes for a specific module, focusing on diffusion and implantation.

Role type

PhD intern, module engineering (semiconductor manufacturing)

Builds

Semiconductor manufacturing processes and equipment performance

Domain

Semiconductor manufacturing, diffusion and implantation processes

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

semiconductor processing fundamentals, statistical data analysis, design of experiments, materials characterization (SEM, TEM)

Preferred skills

advanced transistor device structures, scripting languages (Python, JSL, Perl, TCL), process control systems, device physics

Technologies

SEM, TEM, Atomic Layer Deposition, Chemical Vapor Deposition, Rapid Thermal Annealing, Ion Implantation

Responsibilities

Sustain and improve manufacturing equipment performance, assist in equipment troubleshooting and qualification, apply statistical analysis and design experiments to enhance process reliability, contribute to continuous improvement of process control systems

Seniority

Intern

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