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Module Development Engineering Manager

US, Oregon, Hillsboro💼 Full-time💰 $133,800–$219,550🗓 2026-08-03 → 2026-09-26

Core

Lead a group of engineers in crafting innovative solutions for next-generation technology development in wafer processing, assembly/test, and module repair factories.

Role type

Engineering Manager (Module Development)

Builds

Advanced technology solutions for power performance, structural efficiency, and cost optimization in semiconductor manufacturing.

Domain

Semiconductor manufacturing (wafer processing, assembly/test, module repair)

Deliverable

production ML models | product features | infrastructure

Required skills

Engineering management, technology roadmap definition, cross-functional collaboration, resource management, team coaching/mentoring, strategic planning

Preferred skills

Metrology and defect inspection equipment expertise, semiconductor fabrication knowledge, packaging technologies, advanced module engineering, wafer equipment/process familiarity, singulation techniques, technical leadership in metrology tool ownership

Technologies

Wafer equipment, metrology tools, defect inspection systems

Responsibilities

Lead team development and implementation of advanced technology solutions, define and oversee technology roadmaps, manage resources and priorities, partner with integration/yield teams, build supplier executive partnerships, coach engineering teams on pathfinding, develop long-term engineering strategies

Seniority

Manager, hands-on leadership

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