Quality Engineering Manager-Assembly Packaging Testing Manufacturing
Core
Lead end-to-end Manufacturing Quality leadership across Intel Foundry sites (FSO, Bumping, Wafer Level Assembly, EMIB, etc.) in Arizona, Oregon, and New Mexico.
Role type
Senior IC Quality Engineering Manager (Semiconductor Manufacturing)
Builds
World-class Quality KPIs (LY, CpK, 8D CAPA), supplier improvement programs, and integrated Quality systems across advanced packaging processes.
Domain
Semiconductor manufacturing, advanced packaging, and assembly testing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Cross-functional leadership, excursion management, root cause analysis, 8D standard implementation, supplier quality program management, strategic systemic improvement, multi-site team management
Preferred skills
Semiconductor manufacturing process knowledge (WLA, substrate, test), Foundry customer support experience
Technologies
8D standard, Quality automation systems, process control systems
Responsibilities
Lead and manage Quality Program Managers and Engineers across multiple US sites; Drive Foundry Manufacturing Quality Programs and systems; Lead excursion management and root cause analysis; Champion site-wide quality culture and training; Integrate Quality automation requirements; Analyze quality performance and define improvement strategies; Partner with Supplier Q&R to drive yield and reliability improvements; Lead and govern Quality Review Boards (QRBs); Represent Foundry Manufacturing Quality in cross-functional forums
Seniority
Senior, hands-on IC with people management