Principal Engineer Yield Engineering
Core
Drive yield improvement and product performance for advanced technology nodes (45nm and below) supporting technology transfers and high-volume production.
Role type
Principal Yield Engineer (semiconductor manufacturing)
Builds
High-volume production chips on advanced nodes
Domain
Semiconductor manufacturing / 300mm wafer fab
Required skills
root cause analysis, data analysis, failure analysis, device physics knowledge, submicron FET architecture understanding, experimental design, circuit design and test knowledge, manufacturing robustness optimization
Preferred skills
semiconductor process integration knowledge, high-volume production yield engineering experience, technology transfer support
Technologies
300mm wafer fab, 45nm and below nodes, submicron FET architectures
Responsibilities
Investigate root cause of yield and product functionality issues; Engage with customers on weekly calls to provide yield status and forecasts; Work with Test, Integration, and Process Modules to implement cost-effective improvements; Support process module engineering to improve cost, cycle time, and manufacturing robustness.
Seniority
Senior, hands-on IC
