Principal Engineer Integration & Yield
Core
Lead development, optimization, and integration of semiconductor processes to drive yield improvement, product performance, and manufacturability.
Role type
Principal Process Integration Engineer (Semiconductor)
Builds
Integrated circuits for electronic devices
Domain
Semiconductor manufacturing / Process Integration
Required skills
Semiconductor process integration, Yield engineering, Statistical analysis, DOE methodologies, SPC monitoring, Data-driven problem solving, Device and process knowledge, Defect analysis, Project management, Technical leadership
Preferred skills
Module characterization, Design rule development, Defect source library management, Tool defect fingerprinting, Continuous Improvement Plans (CIP), Failure mode analysis, Risk mitigation, Strategic roadmap development
Technologies
DOE, SPC, Statistical analysis tools, Test structures, Defect characterization tools
Responsibilities
Lead identification and resolution of process integration and yield-related issues, Drive end-to-end project management and advanced data analysis, Develop custom process solutions, Provide technical leadership in resolving complex process challenges, Support new product development with module characterization, Collaborate to reduce defectivity and address yield concerns, Design and enhance test structures for process characterization, Build and maintain defect source libraries, Perform product and process partitioning studies, Ensure thorough documentation of processes and failure modes, Mentor junior engineers, Lead strategic initiatives and technology roadmap development
Seniority
Principal, hands-on IC with strategic leadership