Failure Analysis Engineering Intern (Summer 2027)
Core
Support advanced semiconductor failure analysis through sample preparation, imaging, and analytical techniques to identify root causes of device failures.
Role type
Summer intern, hands-on IC failure analysis engineer
Builds
Diagnostic insights for semiconductor manufacturing yield and reliability
Domain
Semiconductor manufacturing / Failure Analysis
Required skills
sample preparation, microscopy (SEM, TEM, AFM), analytical characterization, cross-sectioning, failure localization methods (OBIRCH, emission/thermal microscopy, FIB, X-ray, SIMS, C-SAM), data interpretation, workflow optimization
Preferred skills
leadership, project management, AI tool usage, complex technical problem solving, MS Office proficiency
Technologies
SEM, TEM, AFM, FIB, OBIRCH, emission microscopy, thermal microscopy, X-ray analysis, SIMS, C-SAM
Responsibilities
Perform sample preparation and imaging; collaborate with shift teams and engineers to define analytical methods; assist in identifying workflow optimization opportunities; participate in continuous improvement activities; communicate results to cross-functional teams
Seniority
Intern, entry-level