Assoc Eng Equipment Engineering (Metrology)
Core
Operate, monitor, and improve backgrinding and dicing processes for semiconductor wafers to support final shipment.
Role type
Associate Engineer (Equipment Engineering - Metrology/Backgrind & Dicing)
Builds
Semiconductor wafers for high-growth markets
Domain
Semiconductor manufacturing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
backgrind process operation, dicing process operation, equipment setup, process control, defect reduction, thickness measurement, SPC data entry, preventive maintenance (PM), incoming/outgoing inspection, laminating, taping/detaping
Preferred skills
experience in OSAT or assembly environments
Technologies
SiView, MS Office
Responsibilities
Support daily run of backgrind and dicing, perform incoming and outgoing inspections, carry out equipment PM according to schedule, key-in SPC data for critical parameters, troubleshoot issues with cross-functional teams, implement process improvements
Seniority
Junior, hands-on IC