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Assoc Eng Equipment Engineering (Metrology)

Singapore💼 Full-time🗓 2026-09-14 → 2026-09-25

Core

Operate, monitor, and improve backgrinding and dicing processes for semiconductor wafers to support final shipment.

Role type

Associate Engineer (Equipment Engineering - Metrology/Backgrind & Dicing)

Builds

Semiconductor wafers for high-growth markets

Domain

Semiconductor manufacturing

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

backgrind process operation, dicing process operation, equipment setup, process control, defect reduction, thickness measurement, SPC data entry, preventive maintenance (PM), incoming/outgoing inspection, laminating, taping/detaping

Preferred skills

experience in OSAT or assembly environments

Technologies

SiView, MS Office

Responsibilities

Support daily run of backgrind and dicing, perform incoming and outgoing inspections, carry out equipment PM according to schedule, key-in SPC data for critical parameters, troubleshoot issues with cross-functional teams, implement process improvements

Seniority

Junior, hands-on IC

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