Manager Packaging Engineering
Core
Manage substrate suppliers to ensure stable supply of IC substrates for CPU/GPU manufacturing, driving NPI, HVM, and yield improvements.
Role type
Manager, External Manufacturing Operations (Substrate)
Builds
IC substrates for leading CPU/GPU companies
Domain
Semiconductor manufacturing / Packaging Engineering
Required skills
Supplier management, NPI/HVM project management, Data analytics, Process optimization, Change management, Technical reporting
Preferred skills
IC Substrate/OSAT experience, FC-BGA/LGA technical expertise, Statistical analysis (DOE, SPC, 6 Sigma), People management, Leadership
Technologies
JMP, Minitab, ESD, JEDEC standards
Responsibilities
Plan and manage substrate supplier qualification from NPI to production release, Drive HVM yield attainment and issue resolution, Monitor supplier performance via scorecards and technical reviews, Lead continuous improvement projects and knowledge sharing, Execute change management initiatives
Seniority
Manager, hands-on leadership
