Engineering Placement Intern - 2027/2028
Core
Intern role focused on hardware/software boundary work, contributing to embedded design, scripting, and system integration for next-gen Adaptive SoCs/FPGAs.
Role type
Engineering Placement Intern (Hardware/Software)
Builds
Full system solutions on Adaptive SoCs/FPGAs, ASIC & FPGA IP design/verification
Domain
Semiconductor, Embedded Systems, Hardware/Software Integration
Required skills
Digital circuit design, Embedded firmware development, Scripting (Python, Tcl, Unix shell), C/C++ programming, RTL development (Verilog/VHDL), Linux development/debugging
Preferred skills
ASIC/FPGA toolchains (Vivado, Vitis, PetaLinux), System design tools
Technologies
Vivado, Vitis, PetaLinux, Verilog, VHDL, Python, Tcl, Unix shell, Linux
Responsibilities
Develop full system solutions on Adaptive SoCs/FPGAs, Work on advanced designs for future FPGA and ASIC devices, Participate in projects spanning Aerospace, Automotive, Industrial, Robotics, and AI domains
Seniority
Intern
