Packaging Engineer, Substrate
Core
Manage substrate suppliers from NPI to production release, ensuring stable supply of IC substrates for CPU/GPU manufacturing.
Role type
Senior IC Substrate Packaging Engineer (Supplier Management)
Builds
IC substrates for leading CPU/GPU company
Domain
Semiconductor manufacturing, IC Substrate
Required skills
Supplier management, NPI/LVM/HVM yield monitoring, Data analytics, Statistical analysis (DOE, SPC, 6 Sigma), Project management, Technical report writing
Preferred skills
FC-BGA/LGA substrate manufacturing expertise, Cross-supplier performance improvement, Knowledge-sharing initiatives
Technologies
FC-BGA, LGA, NPI, HVM, DOE, SPC, 6 Sigma
Responsibilities
Manage substrate supplier qualification and new production site bring-up, Oversee yield monitoring and improvement, Lead continuous improvement projects, Monitor supplier performance via scorecards and technical reviews
Seniority
Mid-Senior, hands-on IC
