Senior Staff Burn-In System Product Developer
Core
Lead architecture, development, and deployment of next-generation burn-in solutions for advanced semiconductor products (CPUs, GPUs, AI accelerators, chiplets) to ensure product quality, reliability, and manufacturing excellence.
Role type
Senior Staff Burn-In System Product Developer
Builds
Scalable, intelligent burn-in systems and infrastructure for HPC and AI chips
Domain
Semiconductor manufacturing, Reliability Engineering, High-Performance Computing
Required skills
Semiconductor burn-in engineering, Reliability engineering, System architecture, Vendor management, Stakeholder leadership, Predictive analytics, Machine learning, Generative AI, Root cause analysis
Preferred skills
Chiplet-based architecture, 2.5D/3D integration, HBM-enabled devices, NPI support, Manufacturing ramp activities
Technologies
Burn-in boards, Sockets, Power delivery systems, Thermal management systems, Automation frameworks, Data pipelines, Dashboards
Responsibilities
Define burn-in system architecture for packaged semiconductors; Develop scalable solutions for advanced package technologies; Lead development of system-level infrastructure (power, thermal, control); Drive vendor management and supplier effectiveness; Collaborate on burn-in strategies for product qualification; Support NPI and manufacturing ramp; Analyze burn-in effectiveness and optimize throughput; Perform root cause analysis for hardware/system issues; Utilize predictive analytics and ML for anomaly detection and yield improvement.
Seniority
Senior Staff, hands-on IC with strategic influence
