CareerPlan

System Design Intern, LDE - 2027

Taiwan, TaipeiInternship2026-07-28 → 2026-11-10
Hybrid

Core

Design and development of next-generation products including Datacenter, GeForce, Virtualization, and Automotive products based on GPUs, DPUs, CPUs, and LPUs.

Role type

System Design Intern (Hardware/Chip Design)

Builds

Graphics, Self-driving platforms, Servers, and Data center products

Domain

Semiconductor hardware design and AI computing infrastructure

Required skills

high-speed signal design, power design methodologies, digital/analog circuit simulation, fault diagnosis, circuit development, critical thinking, problem-solving

Preferred skills

high-speed subsystem design, DC-DC power module design

Technologies

Multisim, Cadence, Concept, OrCAD

Responsibilities

Research new features/circuits/architecture, establish industry standards, implement designs in next-generation products, drive research, design execution, bring-up, issue debugging, and solution implementation to manufacturing, serve as interface to Silicon/Thermal/Mechanical/SI/EMC engineers

Seniority

Intern