Thermal /Mechanical Hybrid Engineer
Core
Design and optimize direct-to-chip cold plate modules and water cooling systems for high-performance AI inference hardware.
Role type
Senior IC thermal/mechanical hybrid engineer
Builds
Direct-to-chip cold plate modules, water cooling manifolds, CDUs, and heat exchangers for data center AI systems
Domain
Hardware infrastructure for frontier AI inference
Deliverable
production ML models | product features
Required skills
mechanical design, thermal simulation, water cooling system design, cold plate design, thermal interface material (TIM) selection, GD&T, DFM/DFA principles
Preferred skills
advanced thermal cooling concepts (phase change), cross-functional collaboration
Technologies
NX, Creo, CATIA, Fluent
Responsibilities
Lead design and optimization of direct-to-chip cold plate modules; develop water cooling solutions including internal manifolds and heat exchangers; run liquid thermal simulations to analyze performance; oversee testing and validation of thermal management systems; create comprehensive design documentation.
Seniority
Senior, hands-on IC