Process Support Engineer (Advanced Packaging)
Core
Guide semiconductor products through lifecycle from concept to qualification, providing on-site customer support, system diagnosis, and repair of complex equipment in cleanroom environments.
Role type
Senior IC process support engineer (advanced packaging)
Builds
Advanced semiconductor chips and display technologies
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Semiconductor process engineering, DOE design, statistical data analysis, root cause analysis, equipment troubleshooting, process optimization, cross-functional collaboration
Preferred skills
Hybrid Bonding, Advanced Packaging experience, Chemical Vapor Deposition, Atomic Layer Deposition, Plasma Reactive Ion Etch, Physical Vapor Deposition, Anneal, Implant
Technologies
Chemical Vapor Deposition, Atomic Layer Deposition, Plasma Reactive Ion Etch, Physical Vapor Deposition, Anneal, Implant
Responsibilities
Perform on-site installations, system diagnoses, and service/repair of complex semiconductor equipment; Develop leading-edge manufacturing processes and create hypothesis/design of experiments (DOE); Analyze process data using statistics to compile technical reports; Troubleshoot complex issues and perform root cause analysis to resolve process and product problems; Collaborate with customers and internal teams to optimize tool uptime and yield.
Seniority
Mid-level, hands-on IC