Process Integration Engineer
Core
Design and optimize manufacturing processes, 3D integration, and packaging solutions for photonic platforms and quantum structures (superconducting qubits, optical quantum computing) to enhance device performance.
Role type
Senior IC process integration engineer (quantum/photonic)
Builds
Advanced packaging solutions and quantum devices with lower error rates
Domain
Semiconductor manufacturing, quantum technology, photonics, materials science
Required skills
3D integration, quantum information, semiconductor processing, advanced packaging, materials engineering, metrology, hardware characterization, root cause analysis, experimental design, data analysis, technical documentation
Preferred skills
Experience with photonic platforms, quantum structures, metasurface-based optics, emerging markets technology
Technologies
Quantum computing hardware, photonic platforms, advanced packaging tools, metrology equipment
Responsibilities
Create process, module, and device integration solutions for photonic and quantum structures; Design and conduct experiments to measure material and device properties; Troubleshoot complex process engineering issues and perform Root Cause Analysis; Collaborate with customers, start-ups, and universities to develop enabling solutions; Generate internal and external technical documentation and reports; Keep up to date with advancements in 3D integration and quantum information to implement new technologies.
