Process Engineering Manager (Electroplating)
Core
Lead the development and optimization of next-generation electroplating processes and technologies for advanced semiconductor packaging applications.
Role type
Manager, Process Engineering (Electroplating)
Builds
Next-generation electroplating processes and technologies for advanced semiconductor packaging
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Electroplating/electrochemical deposition, Copper plating, Wafer-level packaging, RDL, Copper pillars, TSVs, Process characterization, DOE, Statistical analysis, Root cause analysis, Plating chemistry, Defect reduction, Process optimization, People leadership
Preferred skills
Hardware characterization, Analytical instrumentation development, Customer engagement, Cross-functional collaboration
Technologies
Electroplating equipment, Analytical instrumentation
Responsibilities
Manage engineers in utilizing techniques to characterize hardware and apply them to significantly complex systems, Manage and execute process engineering projects for entire range of products, Interact with key customers to resolve significantly complex process engineering issues, Develop and implement new technology, products and analytical instrumentation, Train and implement new methodologies and troubleshoot complex process engineering issues, Generate internal and external documentation and validate process engineering specifications
Seniority
Manager, hands-on IC with team leadership