Senior Quantum 3D Integration and Packaging Engineer
Core
Designing and optimizing 3D integration and packaging solutions for superconducting qubits and optical quantum computing devices.
Role type
Senior IC quantum packaging engineer
Builds
Advanced packaging solutions for quantum information platforms
Domain
Quantum technology / Semiconductor manufacturing / Materials science
Required skills
3D integration, advanced packaging, heterogeneous integration, wafer-level packaging, hybrid bonding, TSV, chiplets, flip-chip, semiconductor fabrication, process integration, materials characterization, metrology, DOE, data analysis, root cause analysis
Preferred skills
Quantum devices, superconducting technologies, photonics, cryogenic systems
Technologies
None explicitly listed beyond general process technologies
Responsibilities
Create 3D integration and packaging solutions for different platforms and quantum structures, Work with advanced packaging, process, hardware, and metrology team to develop new materials, processes, and structures for quantum devices, Design, collect data, analyze and compile reports on a variety of difficult process engineering experiments, Troubleshoot a variety of complex problems, perform Root Cause Analysis and resolve a variety of difficult process engineering issues, Generate internal and external documentation for products, presentations and technical reports, Design and conduct experiment, measure material and device properties and interpret data, Keep up to date with the latest advancements in 3D integration, quantum information, and related fields to continually implement new technologies, enhance approaches, and develop methodologies, Collaborate with customers, start-ups, or universities to identify key problems and develop enabling solutions
