College Intern
Core
Develop and characterize PECVD-grown hexagonal boron nitride (h-BN) thin films for thermal management in advanced semiconductor packaging.
Role type
Materials science intern (thin-film deposition & characterization)
Builds
h-BN thin films for thermal interface applications in semiconductor packaging
Domain
Semiconductor materials / Advanced packaging
Required skills
Materials science fundamentals, Thin-film processing, Semiconductor processing knowledge, Dielectric materials understanding, Electrical characterization, Design of Experiments (DOE), Data analysis, Technical reporting
Preferred skills
None stated
Technologies
PECVD, FTIR, SEM, Ellipsometry, XPS, Electrical measurement tools
Responsibilities
Undergo structured laboratory training on thin-film characterization tools, Support thin-film growth and process monitoring, Conduct material characterization activities, Summarize findings in a scientific report and present results
Seniority
Intern