Director Pathfinding Solutions - Integrated Materials Solutions
Core
Develop and demonstrate next-generation semiconductor process solutions for advanced logic and memory device architectures, operating at the intersection of process engineering, device physics, and materials science.
Role type
Senior IC technical leader (Director level)
Builds
Integrated pathfinding solutions for N+1, N+2 and beyond technology nodes
Domain
Semiconductor manufacturing (FEOL, MOL, BEOL)
Required skills
Advanced semiconductor process integration, Device physics, DTCO analysis, Process development (deposition, etch, implant, epitaxy, CMP, thermal), Customer technical engagement, Cross-BU coordination, Technical thought leadership (publications/patents)
Preferred skills
Experience at semiconductor equipment/materials company, DMTS or equivalent designation, Advanced device architectures (GAA, CFET, 3D DRAM, 4F2, NAND), Advanced metallization and selective processes
Technologies
GAA, CFET, 3D DRAM, 4F2, NAND, Mo, Cu, W
Responsibilities
Develop integrated pathfinding process solutions for advanced logic and memory architectures; Drive hands-on process development spanning deposition, etch, implant, epitaxy, CMP, and thermal processing; Identify and de-risk critical process challenges for N+1 and N+2 technology nodes; Translate customer device performance targets into actionable process solutions; Work across product BUs to assemble end-to-end process flows; Engage directly with senior technologists at key customers (Samsung, Intel, TSMC, etc.); Publish at premier conferences and build a patent portfolio
Seniority
Director, hands-on IC