Manager, Electrical New Product Engineering (ENPIE)
Core
Lead a specialized team of Electrical NPI Engineers to translate complex high-layer count PCA designs from prototype to high-volume production readiness, acting as the technical bridge between internal hardware engineering and external contract manufacturing partners.
Role type
Senior IC Manager, Electrical New Product Introduction (NPI)
Builds
High-performance, high-layer count Printed Circuit Assemblies (PCAs) and PCBs for data center networking equipment
Domain
Hardware Engineering / PCB Manufacturing / Data Center Networking
Required skills
Advanced SMT and high-layer count PCB assembly (30+ layers), Design for Manufacturability (DFM), Failure analysis and root cause analysis (8D), PLM systems (Propel/Agile), ECO/MCO/DEV/PCN processes, Circuit debugging and troubleshooting, Yield and cost optimization
Preferred skills
Team leadership (5+ years), Large form-factor BGA components, Liquid cooled products, Data center equipment lifecycle management, PCB layout review (Allegro)
Technologies
SMT, PCB, BGA, PLM (Propel, Agile), Allegro
Responsibilities
Drive new PCA designs with HW Engineering identifying and resolving DFM for SMT, PCB assembly, and system integration; Optimize complex, high-layer count PCB manufacturing including advanced structures and large BGAs; Oversee process validation, troubleshooting, and failure analysis; Support NPI from prototype to full production and end of life; Manage ECOs and version control using PLM systems; Lead continuous improvement in yield, cost, and quality; Develop best practices for SMT and PCB assembly ensuring IPC/regulatory compliance
Seniority
Senior, hands-on IC with management responsibilities
