Sr Staff Package Design Engineer
Core
Oversees backend semiconductor manufacturing processes and activities at OSATs (Outsourcing Subcontractor Assembly & Test) and serves as the primary technical interface between Renesas and OSATs.
Role type
Senior Staff Package Design Engineer
Builds
Semiconductor packages and products for automotive, industrial, infrastructure, and IoT applications
Domain
Semiconductor manufacturing and process engineering
Required skills
Semiconductor manufacturing process engineering, OSAT management, yield optimization, quality management, delivery management, cost performance management, continuous improvement methodologies, root cause analysis, corrective action implementation, audit management, project management, Six Sigma, AutoCAD
Preferred skills
Automotive products experience, Lean manufacturing principles
Technologies
AutoCAD
Responsibilities
Manage OSATs to meet KPIs for yield, quality, delivery, and cost; collaborate on new packages/products and supplier/process changes; establish and enforce process standards; resolve technical issues and drive operational excellence; support internal and customer audits.
