Mid-end and backend process technology (WET/Integration/Metal deposition/Lithography engineer)
Core
Develop and optimize mid-end and backend semiconductor manufacturing processes (WET, Integration, Metal Deposition, Lithography) for embedded Vertical Power Stages (VPS) and chiplet technologies to support AI server demand.
Role type
Mid-level IC semiconductor process engineer (WET/Integration/Metal/Lithography)
Builds
Embedded VPS (Power Tower Module), chiplet-based power devices, and advanced packaging solutions for automotive, industrial, and IoT markets.
Domain
Semiconductor manufacturing / Power electronics / Advanced packaging
Required skills
WET process development, semiconductor integration, metal deposition, lithography, process startup, yield improvement, material evaluation, equipment evaluation
Preferred skills
Power device knowledge, reliability testing, process improvement, ISO/IATF compliance
Technologies
Cu-RDL, backside metal, ultra-thinning, OPM, dicing, WET equipment, lithography tools
Responsibilities
Promote process development for new products, support manufacturing line startup and mass production transition, drive product quality and yield improvement, develop new materials and manufacturing methods, support cost reduction activities
Seniority
Mid-level, hands-on IC