Principal Failure Analysis Engineer (Semiconductor / Electronics)
Core
Lead failure analysis investigations for semiconductor and electronics clients to identify root causes of defects, design issues, and field failures, enabling product redesigns and containment strategies.
Role type
Principal Failure Analysis Engineer (Semiconductor/Electronics)
Builds
Root cause analysis reports, containment plans, and redesign recommendations for medical, automotive, aerospace, and consumer electronics products.
Domain
Semiconductor manufacturing, electronics reliability, and failure analysis
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Root cause failure analysis, Fault isolation (OBIRCH, XIVA, emmi, IR Thermography), Electrical Test/Measurements (ATE, Curve trace, Bench test), Microprobing/Picoprobing, X-ray (2D), SEM/EDS
Preferred skills
LVP/LTP, SDL/LADA, DBFIB/PFIB, X-ray (CT/3D), Scanning Acoustic Microscopy (C-SAM), Deprocessing (RIE, lapping, etching), Cross sectioning, Nanoprobing, FinFET/advanced node technology, DPA, GDS layout, LabView
Technologies
OBIRCH, XIVA, emmi, IR Thermography, ATE, Curve trace, Bench test, Parametric analyzer, O-scopes, CV measurement, LCR meter, Microprober, Picoprober, SEM, EDS, X-ray 2D, CT, C-SAM, RIE, Ion mill, GDS, LabView
Responsibilities
Conduct technical discussions to understand client scope and expectations; design and execute analytical plans/methods; consult with value-added insight and result interpretation; recommend suitable next steps; lead teams of engineers and manage complex client issues.
Seniority
Principal, hands-on IC with leadership responsibilities
