中間工程・後工程プロセス技術（WET・インテグレーション・メタル成膜・リソグラフィ）(1)
Core
Developing and scaling wet etching, metal deposition, and lithography processes for embedded power semiconductor modules (Smart Power Stage) to enable in-house manufacturing and chiplet technology.
Role type
Semiconductor process engineer (WET/Integration/Metal/Lithography)
Builds
Embedded power modules (PT, VPS) with Cu-RDL, back-side metal, and thinned Si
Domain
Semiconductor manufacturing / Power electronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Wet etching process development, Metal deposition process development, Lithography process development, Process integration, Yield improvement, New material evaluation, Equipment evaluation, Cost reduction
Preferred skills
Power device knowledge, Reliability testing, ISO/IATF compliance
Technologies
CuTi etching, Back-side Si etching, Cu-RDL, Bumping
Responsibilities
Develop new product processes for intermediate and back-end steps, Support manufacturing line setup and mass production transition, Improve product quality and yield, Apply new materials and methods, Reduce costs of existing processes
Seniority
Mid-level, hands-on IC
