Senior Staff Device Characterization Engineer
Core
Oversee and maintain test equipment to perform wafer-level and package-level device characterization, reliability testing, and transient measurements for semiconductor devices.
Role type
Senior Staff Device Characterization Engineer
Builds
Process and device characterization data, reliability test results (HCI, HTRB), and raw I-V curves for power devices.
Domain
Semiconductor manufacturing and device physics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor device characterization, automated prober operation, semiconductor parameter analyzer usage, S-parameter measurement, device physics knowledge, Unix systems proficiency, electronic lab equipment proficiency, test chip debugging, hardware/software upgrade management
Preferred skills
HP RMB or SPECS familiarity, Splus/R/Python/MatLab/JMP familiarity, Cadence Virtuoso layout experience
Technologies
HP4062/4073 testers, EG2080/EG4090, TEL Precio XL probers, HP8753, Cascade full-temperature probers, HP IC-CAP software, Agilent B1500, HP8753D, HP RMB, SPECS, Splus, R, Python, MatLab, JMP, Unix, Cadence Virtuoso
Responsibilities
Utilize HP4062/4073 testers with EG2080, EG4090, and TEL Precio XL probers leveraging custom RMB code; Perform measurements on wafer level and package parts including process and device characterization testing, EPROM testing, device raw I-V curves, and reliability tests like HCI and HTRB; Conduct transient manual measurements such as Gate charge and Reverse recovery; Perform S-Parameter measurements using HP8753D with manual probe station and IC-CAP software; Develop new software as needed by device development and modeling team; Work with other team members to debug test chip programs; Upgrade hardware and software to meet changing testing requirements
Seniority
Senior Staff, hands-on IC
