Electrical New Product Engineering (ENPIE)
Core
Act as a technical bridge between internal hardware engineering teams and external contract manufacturing partners to ensure high-performance, high-layer-count PCB designs are successfully translated into high-volume production readiness.
Role type
Electrical New Product Introduction (NPI) Engineer
Builds
High-performance, high-layer-count Printed Circuit Assemblies (PCAs) and PCBs for data center networking equipment
Domain
Hardware engineering, PCB manufacturing, SMT assembly, Contract Manufacturing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Design for Manufacturability (DFM), high-layer-count PCB structure expertise, SMT assembly processes, BGA assembly, failure analysis, 8D methodology, PLM systems management, BOM risk assessment, component qualification
Preferred skills
PCA design and layout experience, IPC standards knowledge, second sourcing strategies
Technologies
Propel, Agile, PLM systems
Responsibilities
Drive PCA designs and resolve DFM issues for SMT and system integration; Optimize high-layer count PCB manufacturing and BGA assembly; Lead process validation, troubleshooting, and failure analysis; Manage NPI lifecycles from prototype to full production; Manage ECOs and version control via PLM systems; Coordinate cross-functionally with the supply chain for inventory efficiency
Seniority
Mid-Senior, hands-on IC
