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Principal Engineer, Development Engineering

BangPa-in, PHRA NAKHON SI AYUTTHAYA, th💼 Full-time🗓 2026-04-28 → 2026-07-31

Core

Integration engineer and technical project lead evaluating wafer-level designs and materials performance through back-end slider processing in HAMR recording head manufacturing.

Role type

Principal Engineer, Development Engineering (Materials Characterization & AI/ML)

Builds

Wafer-to-slider BE assessments, technology milestone evaluations, and AI/ML-driven prediction models for slider performance.

Domain

Hard drive manufacturing / Magnetic recording / Semiconductor process engineering

Deliverable

production ML models | product features

Required skills

Wafer-to-slider BE assessment, Technology milestone ownership, Cross-functional coordination, AI/ML initiatives, Process automation

Preferred skills

HDD head manufacturing experience, Magnetic recording expertise, Semiconductor process engineering background

Technologies

AFM, SEM, FIB-TEM, Optical microscopy, WD's ML platform, ISA data automation tools

Responsibilities

Evaluate wafer designs at BE through process mapping, electrical measurements, and surface characterization; Track and drive BE evaluations for multiple technology milestones; Lead bi-weekly WF/BE interlock meetings; Drive projects using machine learning for data-driven prediction of slider performance metrics; Develop scripts for ISA data automation and multi-step query tools

Seniority

Principal, hands-on IC with strategic coordination

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