Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory
Core
Define and develop reliability stress test flows and plans for High Bandwidth Memory (HBM) products, driving down defect rates (DPM) and resolving root causes of device failures through electric and physical failure analysis.
Role type
Senior IC reliability engineer (semiconductor manufacturing)
Builds
HBM products for modern computing technologies
Domain
Semiconductor manufacturing / High Bandwidth Memory
Required skills
Electric Failure Analysis (EFA), Physical Failure Analysis (PFA), CMOS technology, DRAM architecture, data analysis, statistics, Python, JMP, root cause analysis, project management, cross-functional collaboration
Preferred skills
Semiconductor device experience, circuit design, product validation, AI/automation integration, process conversion expertise
Technologies
Python, JMP, CMOS, DRAM, HBM
Responsibilities
Define and develop reliability stress test flows and plans; Manage qualification execution and gating issue resolution; Drive DPM reduction via optimized test strategies; Debug and identify root causes of reliability defects; Provide recommendations for fab process conversions to improve yield and cost; Manage risks associated with process conversions; Mentor team members; Make technical decisions on risk analysis and project prioritization; Collaborate with Fab, Design, and Quality teams; Embed AI/automation into reliability workflows.
Seniority
Senior, hands-on IC
