Principal Engineer
Core
Own end-to-end ATE test solutions for silicon bring-up, characterization, production testing, and yield improvement of SoC, RF, and IoT products.
Role type
Senior IC ATE Test Engineer (Semiconductor)
Builds
Wafer-level and package-level test hardware and software for wireless connectivity and microcontroller devices
Domain
Semiconductor manufacturing and testing
Required skills
ATE test development, DFT, mixed-signal and RF testing, Teradyne UltraFLEX/UltraFLEX Plus, Advantest V93K, C/C++/Python/MATLAB, DOE, SPC, circuit analysis
Preferred skills
IG-XL (v10+), lab equipment operation (oscilloscopes, logic analyzers, SMUs), mentoring teams, cross-functional collaboration
Technologies
Teradyne UltraFLEX, UltraFLEX Plus, Advantest V93K, IG-XL, C, C++, Java, Visual Basic, Perl, Python, MATLAB
Responsibilities
Own and drive ATE test solutions and hardware development for wafer-level and package-level testing; Develop, debug, and maintain characterization and production test programs; Design and support multi-site ATE hardware solutions; Apply expertise in DFT, circuit analysis, DOE, and SPC to improve product quality; Lead resolution of customer application issues and RMA investigations; Create and enhance test programs driving manufacturing improvements; Validate product performance and ensure compliance with datasheet specifications; Provide technical guidance and troubleshooting support; Drive device and package qualification; Participate in first silicon bring-up, debug, yield improvement, and test time optimization; Collaborate with cross-functional teams including IP Design, Applications, DFT, and Product Engineering
Seniority
Senior, hands-on IC
