Internship - Unit Process Development
Core
Support engineers to run Design of Experiments (DOE) on die clip attach processes and perform data collection and analysis.
Role type
Intern, Unit Process Development
Builds
Semiconductor power systems and IoT solutions
Domain
Semiconductor manufacturing / Power electronics
Required skills
DOE execution, data collection, data analysis, problem-solving, analytical skills
Preferred skills
Semiconductor industry knowledge, interest in new technology and tools
Technologies
Die clip attach process
Responsibilities
Run DOE on die clip attach process, Perform data collection and analysis of the DOE
Seniority
Intern