SoC HW Systems Engineer — Packaging & IO
Core
Own the package selection strategy, ballout architecture, and IO interface strategy for next-generation automotive microcontroller platforms.
Role type
SoC HW Systems Engineer (Packaging & IO)
Builds
Automotive microcontroller platforms
Domain
Automotive semiconductor hardware design
Required skills
Package selection strategy, ballout architecture, IO ring planning, PCB design constraint analysis, system-level integration, PHY/PMIC compatibility verification, parasitic analysis, cost-performance tradeoff assessment, ISO 26262 compliance documentation
Responsibilities
Own package selection strategy, ballout architecture, and IO ring planning; Analyze and consolidate customer PCB design constraints and system-level integration requirements; Review and maintain platform ballout map; Drive datasheet content for IO electrical parameters; Verify PHY and PMIC compatibility through model-based simulation and parasitic analysis; Assess package performance vs. cost tradeoffs; Maintain technical documentation in compliance with ISO 26262 requirements
