Intern Assembly Process Engineering
Core
Supporting process-sustaining and improvement activities for semiconductor assembly processes including SAW, die attach, wire bonding, and molding.
Role type
Assembly Process Engineering Intern
Builds
Semiconductor assembly processes and quality control
Domain
Semiconductor manufacturing
Required skills
Analytical skills, Problem-solving, Process monitoring, Documentation management, Technical investigation, Microsoft Excel
Preferred skills
Power BI, Mechanical/Materials/Electrical Engineering background
Technologies
SAW, Die attach, Wire bonding, Molding, SPC, FMEA, SOPs
Responsibilities
Support process improvement to enhance quality and yield, Monitor process performance within SPC control limits, Prepare and update process documentation, Provide technical support during critical quality issue investigations
Seniority
Intern