STAGE - Optimisation de dépôt Cu/Ni/Au ou SnAg- F/H
Core
Optimizing multilayer Cu/Ni/Au and Cu/Ni/SnAg electroplating processes for interconnection manufacturing prototypes.
Role type
Intern, electrochemical process engineer (electroplating)
Builds
Multilayer metal deposits for semiconductor interconnection prototypes
Domain
Semiconductor manufacturing / Electrochemistry
Required skills
electrochemistry, experimental design (DOE), cleanroom handling, metrology techniques (acoustic, RS, SEM, TEM, XRF), report writing, industrialization procedures
Preferred skills
microelectronics background, English fluency
Technologies
electroplating equipment, metrology tools (acoustic, RS, SEM, TEM, XRF), process simulation software
Responsibilities
Conduct experiments to optimize deposition parameters (uniformity, speed, cost, electrical characteristics), manage thickness/filling/composition measurement protocols, implement validated improvements into production
Seniority
Intern, final year engineering student or master's student