Process Engineer (Ti-Etch, Solder ball attach, package saw)
Core
Own and improve manufacturing process performance for Plasma Etching, Solder Ball Attach, and Package Saw to achieve stable output, high yield, strong quality, and minimal customer complaints.
Role type
Manufacturing Process Engineer (Semiconductor Assembly)
Builds
Semiconductor chips and packages
Domain
Semiconductor manufacturing
Required skills
Plasma Etching, Solder Ball Attach, Package Saw, process control, troubleshooting, yield improvement, defect reduction, root cause analysis, FMEA, SPC, change management
Preferred skills
excursion prevention, process stabilization, continuous improvement
Technologies
SPC, Cp/Cpk, GR&R
Responsibilities
Drive day-to-day process control and continuous improvement; Act as key process owner for resolving yield loss and quality issues; Lead process characterization, optimization, and qualification; Perform FMEA and risk assessment for process changes; Develop and maintain process recipes, parameters, SOPs, and control plans; Support root cause analysis and corrective/preventive actions.
Seniority
Mid-level, hands-on IC
