CareerPlan

Assembly Technical Staff Engineer

ChinaFull-time2026-08-27 → 2026-11-10

Core

Deploy technical requirements on new subcontractors, define critical process characteristics, drive yield and process improvement projects, and support new product introduction (NPI) and automotive readiness for semiconductor assembly.

Role type

Senior IC assembly technical engineer

Builds

Semiconductor assembly processes and packaging solutions

Domain

Semiconductor manufacturing / Assembly and Packaging

Required skills

Semiconductor assembly processes, APQP, SPC, FMEA, DOE, 8D, statistical analysis, project management, problem solving, MS software

Preferred skills

Automotive readiness project experience, NPI experience, change management, benchmarking

Technologies

MS software

Responsibilities

Deploy technical requirements on new subcontractors, Define critical process characteristics with subcons to fit product characteristics, Yield improvement and process improvement projects, Involve in package maturity (NPI), Involve in automotive readiness project, Develop workable system and template, Manage change management, Package roadmap benchmarking