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FA Engineer

Muar, Malaysia💼 Full-time🗓 2026-08-14 → 2026-10-07

Core

Perform and manage IC failure analysis activities including electrical verification, fault isolation, physical defect localization, and root cause analysis to support quality investigations.

Builds

Root cause analysis reports and corrective/preventive actions for semiconductor chips

Domain

Semiconductor manufacturing and quality engineering

Required skills

IC failure analysis techniques, sample preparation (polishing, decapsulation), imaging (SEM, FIB, X-ray), material analysis (EDX, FTIR), fault isolation (IR-OBIRCH, TEM, EMMI), 8D report validation, cross-functional collaboration

Preferred skills

Semiconductor industry experience, wafer fab/assembly/testing process knowledge, ability to coach technicians

Technologies

SEM, FIB, Plasma FIB, 2D/3D X-ray, EDX, FTIR, IR-OBIRCH, TEM, EMMI

Responsibilities

Perform electrical verification and physical defect localization, prepare and publish FA reports, present findings in cross-functional meetings, review and validate 8D reports, compile customer complaint data, coordinate with technicians and operators

Seniority

Mid-level IC