Failure Analysis Engineer - Physical Analysis
Core
Manage and perform physical and chemical analysis on semiconductor product failures to identify root causes and support engineering decisions.
Role type
Senior IC failure analysis engineer (physical analysis)
Builds
Root cause analysis reports and transfer plans for product divisions
Domain
Semiconductor manufacturing / Materials science
Deliverable
physical/clinical work
Required skills
Sample preparation, 3D X-ray, SEM/EDX, SAM, FIB, material characterization (DSC, TGA), electrochemical methods, crystal morphology analysis, gap analysis, new method development
Preferred skills
Cross-functional collaboration with global R&D teams (via careerplan.io/jobs/563637172373129-failure-analysis-engineer-physical-analysis-at-stmicroelectronics)
Technologies
3D X-ray, SEM/EDX, SAM, FIB, polisher, plasma etch, IC/ICP, DSC, TGA
Responsibilities
Manage/perform sample preparation and physical/chemical analysis activities; Lead gap analysis, new machine evaluation, and new method development; Interface with product division and manage transfer plan
Seniority
Senior, hands-on IC
