Manufacturing Engineer Packaging & OSAT
Core
Own the manufacturing interface between package design, semiconductor assembly, package test, board assembly, and final product integration to make advanced packages manufacturable and transferable to OSAT processes.
Role type
Manufacturing Engineer (Semiconductor Packaging & OSAT)
Builds
Advanced AI compute packages, substrates, and board-level systems for Tenstorrent's AI platform.
Domain
Semiconductor manufacturing, AI hardware, OSAT, and PCB assembly.
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor packaging engineering, OSAT manufacturing processes, PCBA manufacturing, NPI, process transfer, factory commissioning, yield management, data-driven problem solving, technical issue resolution, controlled change implementation.
Preferred skills
Experience with substrate suppliers, bumping suppliers, test houses, contract manufacturers, interpreting package drawings and BOMs, SPC, DOE, PFMEA, 8D, CAPA.
Technologies
RISC-V, BGA, SMT, OSAT equipment, manufacturing execution systems.
Responsibilities
Translate package requirements into executable assembly process flows and manufacturing specifications; lead factory commissioning, line bring-up, pilot builds, and qualification lots; establish process capability targets (Cp/Cpk, yield, FPY) and drive improvements; own technical issue resolution and change implementation across silicon, package, assembly, and test operations.
Seniority
Mid-to-Senior level (5+ years experience required)
