Principal / Senior Engineer, Process Engineering (Advanced Packaging)
Core
Develop innovative semiconductor process technologies for next-generation logic, memory, and power applications, focusing on advanced packaging.
Role type
Principal / Senior Process Engineer (Advanced Packaging)
Builds
Next-generation semiconductor devices (logic, memory, power) via advanced packaging solutions
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Thin-film deposition (ALD, PECVD, PVD, ECP), Materials characterization (XPS, SIMS, RBS, AFM, XRD, TEM, SEM), DOE/RSM experimental design, Process troubleshooting, Technical project management, Intellectual Property generation
Preferred skills
Advanced packaging process flows (CoWoS, SoIC, InFO), Equipment qualification data contribution, Advanced metrology/inspection techniques, Customer-facing technical demonstrations
Technologies
ALD, PECVD, PVD, ECP, XPS, SIMS, RBS, AFM, XRD, TEM, SEM, ellipsometry
Responsibilities
Research and optimize semiconductor processes for advanced packaging; Design and analyze complex experiments using DOE/RSM; Develop new films/processes for hybrid bonding (W2W/D2W); Mentor engineers and lead technical problem-solving; Collaborate with customers to define requirements and execute demos; Troubleshoot equipment and ensure product transfer; Draft technical papers and generate IP; Supervise process engineering technicians
Seniority
Principal / Senior, hands-on IC with mentorship responsibilities
