Engineer I, Field Service
Core
Install, maintain, and troubleshoot advanced semiconductor capital equipment in customer fabrication facilities to maximize performance and minimize downtime.
Role type
Field Service Engineer (Semiconductor Capital Equipment)
Builds
Semiconductor manufacturing systems and equipment
Domain
Semiconductor manufacturing / Capital equipment
Deliverable
physical/clinical work
Required skills
Troubleshooting microprocessor-controlled electromechanical systems, Reading electrical/electronic schematics, Preventative and corrective maintenance, System diagnostics, Working with diagnostic tools (oscilloscopes, DVMs), Cleanroom environment compliance, Domestic and international travel
Preferred skills
Experience with wafer fabrication environments, Vacuum systems knowledge, Closed-loop gas control systems, RF-induced plasma technologies, Robotics and motion control systems, Software fundamentals, Root-cause analysis techniques
Technologies
Semiconductor capital equipment, Microprocessor-based controllers, Vacuum systems, Gas control systems, RF plasma systems
Responsibilities
Assist with installation, qualification, startup, checkout, and decommissioning of equipment; Perform maintenance, upgrades, and repairs; Troubleshoot complex electrical, electronic, mechanical, and software issues; Conduct diagnostic procedures and develop corrective action plans; Implement engineering changes and field modifications; Respond to customer equipment issues; Maintain service documentation and technical reports; Communicate daily status updates and issue escalations; Collaborate with technical support and engineering teams; Adhere to safety procedures and PPE requirements in cleanrooms.
Seniority
Mid-level, hands-on IC