Lead HVM Product Engineer
Core
Support existing high-volume manufacturing products at Asia OSAT partners to ensure on-time customer shipments and maintain smooth production.
Role type
Senior IC product and test engineering lead (semiconductor connectivity)
Builds
High-speed semiconductor connectivity solutions (CXL, Ethernet, NVLink, PCIe, UALink) for hyperscalers and ecosystem partners
Domain
Semiconductor hardware / High-speed connectivity / AI infrastructure
Deliverable
production ML models | product features | infrastructure
Required skills
High-speed XCVR product/test development, PCIe Gen3+ protocols, ATE test program development, SerDes protocols (NRZ/PAM4), memory interfaces (LP)DDR5/4, circuit level analysis (digital/analog), yield monitoring, data analysis (JMP/Spotfire)
Preferred skills
Silicon validation, firmware development (C/C++), Python scripting, product/package qualification
Technologies
Advantest 93k ATE platform, PCIe, Ethernet, CXL, NVLink, UALink, (LP)DDR5/4, JMP, Spotfire
Responsibilities
Partner with OSATs to support high volume manufacturing through the complete product lifecycle, update ATE test programs for wafer sort and final test solutions, monitor device ATE test yields and quality, analyze test data to draw conclusions, ensure seamless production of semiconductor products
Seniority
Senior, hands-on IC
