LEAD PRINCIPAL ENGINEER, ID1 ATE DE PROC
Core
Lead plasma dry etch process development and deployment for state-of-the-art semiconductor manufacturing tools.
Role type
Lead Principal Engineer, Semiconductor Process Development
Builds
Advanced dry etch technologies for High Volume Manufacturing (HVM) fabs
Domain
Semiconductor manufacturing / Plasma etch technology
Required skills
Plasma Dry Etch Technology (ICP, CCP, ECR), Supplier Management, Manufacturing Team Structure Design, Yield and Defectivity Resolution, Statistical Analysis (JMP), SPC and CSPEC Implementation, Technical Project Leadership
Technologies
ICP, CCP, ECR, JMP, SPC, CSPEC
Responsibilities
Develop and deploy advanced dry etch technologies; Establish supplier accountability programs; Define manufacturing team structures and processes; Resolve yield, defectivity, and cycle time issues; Drive MOR-POR gaps and capacity/cost reduction projects; Provide technical guidance to complex projects.
Seniority
Principal, hands-on IC with leadership responsibilities