CareerPlan

OMT Dry Etch MTS

Taichung City, Taichung City, TaiwanFull-time2026-10-30 → 2026-11-10

Core

Lead the development, optimization, and qualification of advanced dry etching processes for leading-edge technology nodes, ensuring best-in-class performance in CD control, profile engineering, selectivity, and defectivity.

Role type

Senior IC dry etch process engineer (semiconductor)

Builds

Advanced memory and storage solutions (DRAM, NAND, NOR)

Domain

Semiconductor manufacturing / Plasma etch

Required skills

Dry etch process development, Plasma physics, Etching chemistry, Thin-film interactions, Reactor design, Statistical process control, High-volume manufacturing (HVM), Technology node scaling

Preferred skills

Cross-functional leadership, Strategic problem-solving, Continuous improvement, Equipment supplier collaboration, Technical roadmap planning

Technologies

Plasma etch platforms, Dry etch equipment, Semiconductor manufacturing tools

Responsibilities

Lead development and optimization of dry etching processes for leading-edge nodes; Drive technology breakthroughs in plasma etch mechanisms and chamber performance; Collaborate with integration and manufacturing teams for robust process transfer; Mentor junior engineers and guide strategic direction; Identify and drive continuous improvement initiatives for yield and cost; Benchmark emerging technologies and evaluate next-generation plasma etch platforms.

Seniority

Senior, hands-on IC